EuroUSEC 2021 BEST PAPER AWARD: T. Matsuura, A. Hasegawa, M. Akiyama, and T. Mori, “Careless Participants Are Essential For Our Phishing Study: Understanding the Impact of Screening Methods“, In Proceedings of the 2021 European Symposium on Usable Security (EuroUSEC 2021), October, 2021. (acceptance rate: 24%=15/62)
NDSS 2020 DISTINGUISHED PAPER AWARD: T. Watanabe, E. Shioji, M. Akiyama, T. Mori, “Melting Pot of Origins: Compromising the Intermediary Web Services that Rehost Websites,” Proceedings of the 26th Network and Distributed System Security Symposium (NDSS2020), pp. 1–15, February 2020 (acceptance rate=17.4%) [PDF]
USENIX WOOT 2018 BEST STUDENT PAPER AWARD: S. Wakabayashi, S. Maruyama, T. Mori, S. Goto, M. Kinugawa, and Y. Hayashi, “A Feasibility Study of Radio-frequency Retroreflector Attack,” Proceedings of the 12th USENIX Workshop on Offensive Technologies (WOOT 2018), August 2018.
ATIS 2017 BEST PAPER AWARD: B. Sun, X. Luo, M. Akiyama, T. Watanabe and T. Mori, “Characterizing Promotional Attacks in Mobile App Store,” Proceedings of the 8th International Conference on Applications and Techniques in Information Security (ATIS 2017), pp. 113-127, July 2017.
WTC 2014 BEST PAPER AWARD: N. Kamiyama, R. Kawahara, T. Mori, “Loss Recovery Method for Content Pre-distribution in VoD Service“, Proceedings of the World Telecommunications Congress (WTC 2014), pp.1-6, June 2014 [IEEE Xplore]
Best posters/demos
ASIACCS 2014 BEST POSTER AWARD: T. Watanabe and T. Mori,”Understanding the consistency between words and actions for Android apps.”,(poster presentation) 9th ACM Symposium on Information, Computer and Communications Security(ASIACCS 2014), Kyoto, Japan, June 2014 [poster]
IA研究会 2015年度研究賞: A. Shimoda, K. Ishibashi, S. Harada, K. Sato, M. Tsujino, T. Inoue, M. Shimura, T. Takebe, K. Takahashi, T. Mori, and S. Goto, Inferring the Number of Accesses to Internet Services using DNS Traffic, 信学技報, vol. 115, no. 307, IA2015-63, pp. 129-134, 2015年11月.
ISEC研究奨励賞: Jan Goette, Naoto Yanai, and Tatsuya Mori, “SecureHID: Securing the USB Interface,” IEICE Tech. Rep., vol. 119, no. 140, ISEC2019-35, pp. 199–206, July 2019